{"id":1175,"date":"2022-11-23T13:29:34","date_gmt":"2022-11-23T05:29:34","guid":{"rendered":"http:\/\/www.xbjq.com.cn\/?page_id=1175"},"modified":"2022-12-01T13:16:29","modified_gmt":"2022-12-01T05:16:29","slug":"dzzysb23","status":"publish","type":"page","link":"http:\/\/www.xbjq.com.cn\/dzzysb23\/","title":{"rendered":"P74009\/ZF \u578b\u7ea2\u5916\u7126\u5e73\u9762\u63a2\u6d4b\u5668\u81ea\u52a8\u7c98\u7247\u673a"},"content":{"rendered":"\n
P74009\/ZF <\/strong>\u578b\u7ea2\u5916\u7126\u5e73\u9762\u63a2\u6d4b\u5668\u81ea\u52a8\u7c98\u7247\u673a<\/strong><\/strong><\/p>\n\n\n\n P74009\/ZF Infrared Focal Plane Detector Automatic Die Bonder<\/strong><\/strong><\/p>\n<\/div><\/div>\n\n\n\n P74009\/ZF \u578b\u7ea2\u5916\u7126\u5e73\u9762\u63a2\u6d4b\u5668\u81ea\u52a8\u7c98\u7247\u673a P74009\/ZF Infrared Focal Plane Detector Automatic Die Bonder \u73bb\u7483\u57fa\u677f\u5c3a\u5bf8 Glass base plate size 3″\/4″ […]<\/p>\n","protected":false},"author":1,"featured_media":0,"parent":0,"menu_order":0,"comment_status":"closed","ping_status":"closed","template":"","meta":[],"yoast_head":"\r\n\u73bb\u7483\u57fa\u677f\u5c3a\u5bf8 Glass base plate size<\/td> 3″\/4″\/6″\uff0c\u539a\u5ea6 thickness 4mm\uff5e7mm<\/td><\/tr> \u6676\u7247\u6750\u6599 Crystal chip material<\/td> \u78b2\u950c\u9549\u3001\u9511\u5316\u94df CdZnTe\u3001 InSn<\/td><\/tr> \u6676\u7247\u5c3a\u5bf8 Crystal chip size<\/td> \u89c4\u5219\u6676\u7247 Regular crystal chip 3\u00d710mm\uff08Min\uff0980\u00d780mm\uff08Max\uff09
\u4e0d\u89c4\u5219\u6676\u7247 Irregular crystal chip\uff08\u5706\u5f27\u76f4\u5f84 Arc diameter\uff09\u2264120mm<\/td><\/tr>\u52a0\u70ed\u6e29\u5ea6 Heating temperature<\/td> 25\u2103\uff5e80\u2103\uff08\u53ef\u5b9a\u53ef\u8c03 adjustable\uff09<\/td><\/tr> \u966a\u8fb9 Edge<\/td> \u89c4\u5219\u6676\u7247\u8981\u6709\u966a\u8fb9\uff1a 4 \u6761\uff0c\u5bbd\u5ea6 4mm
The regular crystal chip with edges: 4, thickness 4mm<\/td><\/tr>\u966a\u8fb9\u8981\u6c42 Edge requirement<\/td> 100 \u500d\u653e\u5927\u955c\u68c0\u6d4b\u4e0b\u4eba\u5de5\u8f85\u52a9\u5b8c\u6210\u65e0\u660e\u663e\u7f1d\u9699\u62fc\u63a5
Accomplish no obvious gap splicing manually under the test by 100 times magnifying glass<\/td><\/tr><\/tbody><\/table><\/figure>\n<\/div><\/div>\n\n\n\n\u7528\u9014\uff1a\u81ea\u52a8\u7c98\u7247\u673a\u4e3b\u8981\u7528\u4e8e\u78b2\u950c\u9549\u3001\u9511\u5316\u94df\u7b49\u7ea2\u5916\u5668\u4ef6\u6676\u7247\u7684\u81ea\u52a8\u7c98\u63a5\u3002
Application: the automatic die bonder is mainly used to bond CdZnTe and InSn Infrared crystal chip automatically.<\/td><\/tr>\u6676\u7247\u4e0a\u8868\u9762\u4e0e\u57fa\u677f\u4e0a\u8868\u9762\u5e73\u884c\uff0c\u5141\u5dee\u22642\u00b5m\uff08\u6676\u7247\u4e0e\u57fa\u677f\u81ea\u8eab\u5e73\u9762\u5ea6\u22642\u00b5m\uff09
The crystal chip surface is parallel with the base plate surface. Tolerance\u22642\u00b5m (Flatness of the crystal chip and the base plate \u22642\u00b5m) <\/td><\/tr>\u7c98\u63a5\u5b8c\u56fa\u5316\u91c7\u7528\u5e38\u6e29\u81ea\u7136\u51b7\u5374 solidification after bonding uses natural cooling in normal temperature<\/td><\/tr> \u8bbe\u5907\u7ec4\u6210\uff1a\u8bbe\u5907\u7531\u5e95\u5ea7\u3001\u4e0a\u6599\u673a\u6784\u3001\u6293\u53d6\u673a\u6784\u3001\u6ef4\u8721\u673a\u6784\u3001\u65cb\u8f6c\u8f7d\u7247\u53f0\u3001\u6324\u538b\u673a\u6784\u3001\u4e0b\u6599\u673a\u6784\u3001\u4e09\u7ef4\u5e73\u53f0\u3001\u5927\u7406\u77f3\u53f0\u9762\u3001\u653e\u6599\u5de5\u4f4d\u3001\u9632\u62a4\u95e8\u7f69\u548c\u7535\u6c14\u63a7\u5236\u7cfb\u7edf\u7b49\u7ec4\u6210\u3002
The equipment composition: the base, material feeding mechanism, grab mechanism, wax dripping mechanism, rotary chip stage, extruding mechanism, unloading mechanism, 3D platform, marble table, material discharging position, protection door cover and electrical control system etc.<\/td><\/tr><\/tbody><\/table><\/figure>\n<\/div><\/div>\n","protected":false},"excerpt":{"rendered":"