P74009/ZF 型紅外焦平面探測器自動粘片機
P74009/ZF Infrared Focal Plane Detector Automatic Die Bonder
| 玻璃基板尺寸 Glass base plate size | 3″/4″/6″，厚度 thickness 4mm～7mm |
| 晶片材料 Crystal chip material | 碲鋅鎘、銻化銦 CdZnTe、 InSn |
| 晶片尺寸 Crystal chip size | 規則晶片 Regular crystal chip 3×10mm（Min）80×80mm（Max） 不規則晶片 Irregular crystal chip（圓弧直徑 Arc diameter）≤120mm |
| 加熱溫度 Heating temperature | 25℃～80℃（可定可調 adjustable） |
| 陪邊 Edge | 規則晶片要有陪邊： 4 條，寬度 4mm The regular crystal chip with edges: 4, thickness 4mm |
| 陪邊要求 Edge requirement | 100 倍放大鏡檢測下人工輔助完成無明顯縫隙拼接 Accomplish no obvious gap splicing manually under the test by 100 times magnifying glass |
| 用途：自動粘片機主要用于碲鋅鎘、銻化銦等紅外器件晶片的自動粘接。 Application: the automatic die bonder is mainly used to bond CdZnTe and InSn Infrared crystal chip automatically. |
| 晶片上表面與基板上表面平行，允差≤2μm（晶片與基板自身平面度≤2μm） The crystal chip surface is parallel with the base plate surface. Tolerance≤2μm (Flatness of the crystal chip and the base plate ≤2μm) |
| 粘接完固化采用常溫自然冷卻 solidification after bonding uses natural cooling in normal temperature |
| 設備組成：設備由底座、上料機構、抓取機構、滴蠟機構、旋轉載片臺、擠壓機構、下料機構、三維平臺、大理石臺面、放料工位、防護門罩和電氣控制系統等組成。 The equipment composition: the base, material feeding mechanism, grab mechanism, wax dripping mechanism, rotary chip stage, extruding mechanism, unloading mechanism, 3D platform, marble table, material discharging position, protection door cover and electrical control system etc. |